Montrose M.I. Emc & the Printed Circuit Board: Design, Theory, & Layout Made Simple

Wiley-IEEE Press, 1998. — 325 p. — ISBN 078034703X, 978-0780347038.This accessible, new reference work shows how and why RF energy is created within a printed circuit board and the manner in which propagation occurs. With lucid explanations, this book enables engineers to grasp both the fundamentals of EMC theory and signal integrity and the mitigation process needed to prevent an EMC event. Author Montrose also shows the relationship between time and frequency domains to help you meet mandatory compliance requirements placed on printed circuit boards.
Using real-world examples the book features:
Clear discussions, without complex mathematical analysis, of flux minimization concepts;
Extensive analysis of capacitor usage for various applications;
Detailed examination of components characteristics with various grounding methodologies, including implementation techniques;
An in-depth study of transmission line theory;
A careful look at signal integrity, crosstalk, and termination.Preface.

EMC Fundamentals.
Fundamental Definitions.
EMC Concerns for the Design Engineer.
The Electromagnetic Environment.
The Need to Comply (A Brief History of EMI).
Potential EMI/RFI Emission Levels for Unprotected Products.
Methods of Noise Coupling.
Nature of Interference.
PCBs and Antennas.
Causes of EMI—System Level.
Summary for Control of Electromagnetic Radiation.EMC Inside The PCB.
EMC and the PCB.
Theory of Electromagnetics (Made Simple).
Relationship Between Electric and Magnetic Sources (Made Simple).
Maxwell Simplified—Further Still.
Concept of Flux Cancellation (Flux Minimization).
Skin Effect and Lead Inductance.
Common-Mode and Differential-Mode Currents.
Velocity of Propagation.
Critical Frequency (X/20).
Fundamental Principles and Concepts for Suppression of RF Energy.Components and EMC.
Edge Rate.
Input Power Consumption.
Clock Skew.
Component Packaging.
Ground Bounce.
Lead-to-Lead Capacitance.
Grounded Heatsinks.
Power Filtering for Clock Sources.
Radiated Design Concerns for Integrated Circuits.
Summary for Radiated Emission Control—Component Level.Image Planes.
Overview.
5/5 Rule.
How Image Planes Work.
Ground and Signal Loops (Not Eddy Currents).
Aspect Ratio—Distance Between Ground Connections.
Image Planes.
Image Plane Violations.
Layer Jumping—Use of Vias.
Split Planes.
Partitioning.
Isolation and Partitioning (Moating).
Interconnects and RF Return Currents.
Layout Concerns for Single-and Double-Sided Boards.
Gridded Ground System.
Localized Ground Planes.Bypassing and Decoupling.
Review of Resonance.
Physical Characteristics.
Capacitors in Parallel.
Power and Ground Plane Capacitance.
Lead-Length Inductance.
Placement.
Selection of a Decoupling Capacitor.
Selection of Bulk Capacitors.
Designing a Capacitor Internal to a Componnet's Package.
Vias and Their Effects in Solid Power Planes.Transmission Lines.
Overview on Transmission Lines.
Transmission Line Basics.
Transmission Line Effects.
Creating Transmission Lines in a Multilayer PCB.
Relative Permittivity (Dielectric Constant).
Routing Topologies.
Routing Concerns.
Capacitive Loading.Signal Integrity and Crosstalk.
Need for Signal Integrity.
Reflections and Ringing.
Calculating Trace Lengths (Electrically Long Traces).
Loading Due to Discontinuities.
RF Current Distribution.
Crosstalk.
The 3-W Rule.Trace Termination.
Transmission Line Effects.
Termination Methodologies.
Terminator Noise and Crosstalk.
Effects of Multiple Terminations.
Trace Routing.
Bifurcated Lines.
Summary—Termination Methods.Grounding.
Reasons for Grounding—An Overview.
Definitions.
Fundamental Grounding Concepts.
Safety Ground.
Signal Voltage Referencing Ground.
Grounding Methods.
Controlling Common-Impedance Coupling Between Traces.
Controlling Common-Impedance Coupling in Power and Ground.
Ground Loops.
Resonance in Multipoint Grounding.
Field Transfer Coupling of Daughter Cards to Card Cage.
Grounding (I/O Connector).Glossary.

Appendixes.

About the Author.