Ott Henry W. Electromagnetic Compatibility Engineering

John Wiley & Sons, 2009. — 872 p. — ISBN 978-0-470-18930-6.Electromagnetic Compatibility Engineering started out being a third edition to my best selling book Noise Reduction Techniques in Electronic Systems, 2nd edition, but it turned out to be much more than that, hence, the title change. Nine of the original twelve chapters were completely rewritten. In addition, there are six new chapters, plus two new appendices, with over 600 pages of new and revised material (including 342 new figures). Most of the new material relates to the practical application of the theory of electromagnetic compatibility (EMC) engineering, and it is based on experience gained from my EMC consulting work, and the teaching of EMC training seminars over the last 20 plus years.
This book is intended primarily for the practicing engineer who is involved in the design of electronic equipment or systems and is faced with EMC and regulatory compliance issues. It addresses the practical aspects of electromagnetic compatibility engineering, covering both emission and immunity. The concepts presented in this book are applicable to analog and digital circuits operating from below audio frequencies up to those operating in the GHz range. Emphasis is on cost-effective EMC designs. Electromagnetic Compatibility Engineering is the most comprehensive book on the subject and reflects all the latest advances and developments in the field.EMC Theory.
Electromagnetic Compatibility.Noise and Interference.
Designing for Electromagnetic Compatibility.
Engineering Documentation and EMC.
United States’ EMC Regulations.
Canadian EMC Requirements.
European Union’s EMC Requirements.
International Harmonization.
Military Standards.
Avionics.
The Regulatory Process.
Typical Noise Path.
Methods of Noise Coupling.
Miscellaneous Noise Sources.
Use of Network Theory.
Cabling.
Capacitive Coupling.
Effect of Shield on Capacitive Coupling.
Inductive Coupling.
Mutual Inductance Calculations.
Effect of Shield on Magnetic Coupling.
Shielding to Prevent Magnetic Radiation.
Shielding a Receptor Against Magnetic Fields.
Common Impedance Shield Coupling.
Experimental Data.
Example of Selective Shielding.
Shield Transfer Impedance.
Coaxial Cable Versus Twisted Pair.
Braided Shields.
Spiral Shields.
Shield Terminations.
Ribbon Cables.
Electrically Long Cables.
Grounding.
AC Power Distribution and Safety Grounds.
Signal Grounds.
Equipment/System Grounding.
Ground Loops.
Low-Frequency Analysis of Common-Mode Choke.
High-Frequency Analysis of Common-Mode Choke.
Single Ground Reference for a Circuit.
Balancing and Filtering.
Balancing.
Filtering.
Power Supply Decoupling.
Driving Capacitive Loads.
System Bandwidth.
Modulation and Coding.
Passive Components.
Capacitors.
Inductors.
Transformers.
Resistors.
Conductors.
Transmission Lines.
Ferrites.
Shielding.
Near Fields and Far Fields.
Characteristic and Wave Impedances.
Shielding Effectiveness.
Absorption Loss.
Reflection Loss.
Composite Absorption and Reflection Loss.
Summary of Shielding Equations.
Shielding with Magnetic Materials.
Experimental Data.
Apertures.
Waveguide Below Cutoff.
Conductive Gaskets.
The ‘‘IDEAL’’ Shield.
Conductive Windows.
Conductive Coatings.
Internal Shields.
Cavity Resonance.
Grounding of Shields.
Contact Protection.
Glow Discharges.
Metal-Vapor or Arc Discharges.
AC Versus DC Circuits.
Contact Material.
Contact Rating.
Loads with High Inrush Currents.
Inductive Loads.
Contact Protection Fundamentals.
Transient Suppression for Inductive Loads.
Contact Protection Networks for Inductive Loads.
Inductive Loads Controlled by a Transistor Switch.
Resistive Load Contact Protection.
Contact Protection Selection Guide.
Examples.
Intrinsic Noise Sources.
Thermal Noise.
Characteristics of Thermal Noise.
Equivalent Noise Bandwidth.
Shot Noise.
Contact Noise.
Popcorn Noise.
Addition of Noise Voltages.
Measuring Random Noise.
Active Device Noise.
Noise Factor.
Measurement of Noise Factor.
Calculating S/N Ratio and Input Noise Voltage from Noise Factor.
Noise Voltage and Current Model.
Measurment of V_n and I_n.
Calculating Noise Factor and S/N Ratio from V_n–I_n.
Optimum Source Resistance.
Noise Factor of Cascaded Stages.
Noise Temperature.
Bipolar Transistor Noise.
Field-Effect Transistor Noise.
Noise in Operational Amplifiers.
Digital Circuit Grounding.
Frequency Versus Time Domain.
Analog Versus Digital Circuits.
Digital Logic Noise.
Internal Noise Sources.
Digital Circuit Ground Noise.
Ground Plane Current Distribution and Impedance.
Digital Logic Current Flow.EMC Application.
Digital Circuit Power Distribution.
Power Supply Decoupling.
Transient Power Supply Currents.
Decoupling Capacitors.
Effective Decoupling Strategies.
The Effect of Decoupling on Radiated Emissions.
Decoupling Capacitor Type and Value.
Decoupling Capacitor Placement and Mounting.
Bulk Decoupling Capacitors.
Power Entry Filters.
Digital Circuit Radiation.
Differential-Mode Radiation.
Controlling Differential-Mode Radiation.
Common-Mode Radiation.
Controlling Common-Mode Radiation.
Conducted Emissions.
Power Line Impedance.
Switched-Mode Power Supplies.
Pow er-Line Filters.
Primary-to-Secondary Common-Mode Coupling.
Frequency Dithering.
Power Supply Instability.
Magnetic Field Emissions.
Variable Speed Motor Drives.
Harmonic Suppression.
RF and Transient Immunity.
Performance Criteria.
RF Immunity.
Transient Immunity.
Power Line Disturbances.
Electrostatic Discharge.
Static Generation.
Human Body Model.
Static Discharge.
ESD Protection in Equipment Design.
Preventing ESD Entry.
Hardening Sensitive Circuits.
ESD Grounding.
Nongrounded Products.
Field-Induced Upset.
Transient Hardened Software Design.
Time Windows.
PCB Layout and Stackup.
General PCB Layout Considerations.
PCB-to-Chassis Ground Connection.
Return Path Discontinuities.
PCB Layer Stackup.
Mixed-Signal PCB Layout.
Split Ground Planes.
Microstrip Ground Plane Current Distribution.
Analog and Digital Ground Pins.
When Should Split Ground Planes Be Used?
Mixed Signal ICs.
High-Resolution A/D and D/A Converters.
A/D and D/A Converter Support Circuitry.
Vertical Isolation.
Mixed-Signal Power Distribution.
The IPC Problem.
Precompliance EMC Measurements.
Test Environment.
Antennas Versus Probes.
Common-Mode Currents on Cables.
Near Field Measurements.
Noise Voltage Measurements.
Conducted Emission Testing.
Spectrum Analyzers.
EMC Crash Cart.
One-Meter Radiated Emission Measurements.
Precompliance Immunity Testing.
Precompliance Power Quality Tests.
Margin.Appendixes:
The Decibel.
The Ten Best Ways to Maximize the Emission from Your Product.
Multiple Reflections of Magnetic Fields in Thin Shields.
Dipoles for Dummies.
Partial Inductance.
Answers to Problems.