NY.: AIP Publishing Books, 2023 — 278 p.
The advent of microelectromechanical systems, commonly abbreviated as MEMS, has brought in the advantages of interfacing mechanical components with electronic circuits to realize a complete overall system. The three-dimensional (3D) nature of such mechanical components allows efficient implementation of MEMS devices towards sensing and communication by tapping on to the ability of MEMS devices being displaced under external stimuli. Such a motion of MEMS devices can be detected both electrically and optically.