Hong Meng, Wei Huang (Eds.) Flexible Electronic Packaging and Encapsulation Technology

Wiley-VCH, 2024. — 372 p.Overview of Flexible Electronic Encapsulating Technology.
Basic Concepts Related to Flexible Electronic Packaging.
Flexible Substrates.
Test Methods.
Flexible Electronic Encapsulation.
Development of Flexible Electronics Packaging Technology.
Application of Flexible Electronics Packaging.
Testing Standards.
Analysis of Flexible Electronic Packaging Enterprise.
Flexible Electronics Packaging Development Trends.