Khanna V.K. Flexible Electronics, Volume 1: Mechanical Background, Materials and Manufacturing

Bristol: IOP Publishing, 2019. — 371 p.This volume covers the mechanical aspects of hard-film/soft-substrate structures and the impacts of stress and strain, including deformation and cycling of ductile films, and straining permeation barriers.The flexible electronics paradigm
Mechanical background
Mechanical bending of a circuit
Stresses and strains in the hard-film–soft-substrate structure
Curvature and overlay alignment of the hard-film–soft-substrate structure
Providing stretchability by controlled buckling of films
Bending brittle films
Deformation and cycling of ductile films
Straining permeation barriers
Materials
Inorganic materials
Organic materials
Nanomaterials: CNTs, nanowires, graphene and 2D materials
Manufacturing equipment and machines
Printing techniques
Vacuum deposition
Silicon microelectronics/MEMS processes
Packaging