Ter Maten E.J.W., Brachtendorf H.-G., Pulch R., Schoenmaker W., De Gersem H. (Eds.) Nanoelectronic Coupled Problems Solutions

Springer, 2019. — 601 p. — (Mathematics in Industry 29). — ISBN: 978-3-030-30725-7.Designs in nanoelectronics often lead to challenging simulation problems and include strong feedback couplings. Industry demands provisions for variability in order to guarantee quality and yield. It also requires the incorporation of higher abstraction levels to allow for system simulation in order to shorten the design cycles, while at the same time preserving accuracy.Nanoelectronic Coupled Problems Solutions – Highlights from the nanoCOPS Project
EM-Equations, Coupling to Heat and to Circuits
Bond Wire Models
Discretizations
Automated Generation of Netlists from Electrothermal Field Models
Holistic / Monolithic Time Integration
Non-Intrusive Methods for the Cosimulation of Coupled Problems
Multirate Circuit - EM - Device Simulation
Uncertainty Quantification: Introduction and Implementations
Robust Shape Optimization under Uncertainties in Device Materials, Geometry and Boundary Conditions
Going from Parameter Estimation to Density Estimation
Inverse Modeling: Glue-Package-Die Problem
Parametric Model Order Reduction for Electro-Thermal Coupled Problems
Sparse (P)MOR for Electro-Thermal Coupled Problems with Many Inputs
Reduced Models and Uncertainty Quantification
Estimating Failure Probabilities
Fast Fault Simulation for Detecting Erroneous Connections in ICs
Calibration of Probability Density Function
Ageing Models and Reliability Prediction
Test Cases for Power-MOS Devices and RF-Circuitry
Measurements for RF Amplifiers, Bond Wire Fusing and MOS Power Cells
Validation of Simulation Results on Coupled Problems
Methodology and Best-Practice Guidelines for Thermally Optimized Driver Design