Kelly J., Engelhardt M. Advanced Production Testing of RF, SoC, and SiP Devices

Boston: Artech House, Inc. 2007. — 326 p. — ISBN: 978-1580537094.Engineers Kelly and Engelhardt present a follow-up to the 2004 Production Testing of RF and System-on-a-Chip Devices for Wireless Communications by Keith Schaub and Joe Kelly. They explain more advanced topics in testing radio-frequency (RF) and system-on-a-chip (SoC) devices and the peripherals associated with that testing. They write primarily for applications engineers, engineering managers, product engineers, and students who have either digested the earlier book or otherwise acquired the fundamentals.Preface.

Concepts of Production Testing of RF, SoC, and SiP Devices.Test and Measurement.
Production Test Systems.
The Peripherals of Production Testing.
The Test Program.
Calibration.
Reducing Test Costs.
Testing RF, SoC, and SiP Devices.Tests and Measurements I: Fundamental RF Measurements..
S-Parameters.
PLL Measurements.
Power Measurements.
Power-Added Efficiency.Tests and Measurements II: Distortion.Linearity.
Distortion in SoC Devices.
Transfer Function for Semiconductor Devices.
Harmonic Distortion.
Intermodulation Distortion.
Measuring Intermodulation Distortion.
Source Intermodulation Distortion.
Cross Modulation.
Gain Compression.
Minimizing the Number of Averages in Distortion Measurements.Tests and Measurements III: Noise.
Introduction to Noise.
Noise Figure.
Phase Noise.Advances in Testing RF and SoC Devices.System-Level Testing.
RF Wafer Probing.
SiP Versus SoC Architectures.
Designers’ New Responsibilities.
RF Built-In Self-Test (BIST).
Test System Architecture.
Testing Wide Bandwidth Devices.Production Test Equipment.Tuned RF Receivers Utilizing a Digitizer.
Modern IC Power Detectors.
Production Testing Using Digital Channels and PMU.
Digitizers (ADCs).
Arbitrary Waveform Generators.
Use of DSP in Production Test Equipment.
Communicating with ATE Hardware.
Summary References.Cost of Test.Parameters Contributing to the COT.
Basic COT Model.
Multisite and Ping-Pong COT Models.
COT Considerations When Using Test Houses.
Accuracy and Guardbands.Calibration.
Overview.
Calibration Procedures.Contactors.Types of Contactors.
Contactor Properties.
Load Board Considerations.
Handler Considerations.
Overall Equipment Effectiveness.
Maintenance and Inspection of Contactors.
Manual Hold-Downs.
Cost Considerations.Handlers.Handler Types.
Choosing a Handler Type.
Throughput.
Testing at Various Temperatures.
Contacting the Device to the Load Board.
Handler Footprint.
Tester Interface Plane.
Device Input and Output.
Conversion and Changeover Kits.Load Boards.Materials.
Electrical.
Mechanical Design Considerations for Load Boards.
Thermal Design Considerations for Load Boards.
Load Board Verification.
General Debugging and Design Considerations.Wafer Probing.
RF Wafer Probing.
Yield of MCM Justifies Wafer Probing.
Probe Cards.
Types of Probe Cards.
Selecting a Probe Card.
Tester to Wafer Prober Interface.
Calibration Methods for Measurements with Wafer Probing.Appendixes:
Power and Voltage Conversions.
VSWR, Return Loss, and Reflection Coefficient.
RF Coaxial Cables.
RF Connectors.
Decimal to Hexadecimal and ASCII Conversions.
Numerical Prefixes.
About the Authors.