BR Publishing, Inc., 2009. — 631 p. — ISBN: 978-0-9796189-1-8.
Foreword
Authors
Introduction to High-Density Interconnects
The HDI Market
Design of Advanced Printed Circuits (HDI)
Electrical Performance
Materials for HDI
The HDI Manufacturing Processes
Small Hole Via Formation
Desmear and Metallization
Fine-Line Imaging and Etching
Electrodeposition and Solderable Finishes for HDI
Electrical Test of High-Density Interconnects
Quality, Acceptability and Reliability
Assembly and Test Processes for HDI
Embedded Components
Advanced HDI Structures and Next Generation Technologies
Advanced Packaging and System-in-Packages