Wei X.-C. Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

CRC Press, 2017. — 341 p. — ISBN: 9781138033566.Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network.
This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.Preface.

About the Author.
Acronyms.

Electromagnetic Compatibility for High-Speed Circuits.
EMC Challenges.
EMC Modeling.
EMC Designs.
Organization of Ths Book.Modal Field of Power–Ground Planes and Grids.
Wave Equation and Its Solution by Using the Green’s Function.
Modal Field.
Impedance Matrix of Power–Ground Planes.
Imaging Method.
Power–Ground Grids.Integral Equation Solutions.
2D Integral Equation Solution.
3D Integral Equation Solution.
Power–Ground Planes with Narrow Slots.Extraction of Via Parameters.
De-Embedding Method for Though-Hole Vias.
Cylindrical Mode Expansion Method for TGVs.Printed Circuit Board-Level Electromagnetic Compatibility Design.
Reduction of PGP Impedances.
CM Filter.
PCB-Embedded Structure.Interposer Electromagnetic Compatibility Design.
Double-Shielded Interposer.
Compact Integrated Waveguide.New Structures and Materials.
High-Impedance Surface.
Graphene.