Pavlidis V., Savidis I., Friedman E. Three-Dimensional Integrated Circuit Design

2nd Edition. — Morgan Kaufmann, 2017. — 748 p. — ISBN: 978-0-12-410501-0.This book, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. View more >Key FeaturesOffers practical guidance on designing 3-D heterogeneous systems
Provides power delivery of 3-D ICs
Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more
Provides experimental case studies in power delivery, synchronization, and thermal characterization