Viswanadham P., Agonafer D. Essentials of electronic packaging: a multidisciplinary approach

New York: ASME Press, 2011. — 392 p.This book provides the basic essentials and fundamentals of electronic packaging technology. It introduces the language and terminology, as well as the basic building blocks of information processing technology such as: (a) printed wiring boards and laminates; (b) various types of components and packages; (c) materials and processes; (d) fundamentals of reliability and relevant reliability enhancement methods, and (e) typical failures observed are described. A fully tested semiconductor device is the starting point for this text. Thus, no background in the semiconductor design or fabrication is assumed. The reader is exposed to the interaction and convergence of various disciplines such as chemistry, physics, materials science, metallurgy, process engineering in the fabrication of an electronic appliance. The reader is also made aware of the emerging trends in electronic packaging to prepare him or her for the near-term miniaturization and integration of technology trends.Dedication.Foreword.Electronic Packaging.
Information Processing Tools.
Hierarchy of Packaging.
Packaging Nomenclature.
Product Categories.
Suggested Reading.Exercises.Substrate and Laminate TechnologiesCeramic Substrate Technologies.
Printed Wiring Board Technology (Conventional).
Flexible Laminate Circuits.
High-Density Printed Wiring Board Technologies.
Surface Finishes.
Suggested Reading.Exercises.First-Level Packaging—Packaging and Component TechnologiesCeramic Packages.
Plastic Packages.
Anatomy of a Package.
Insertion Mount Leaded Packages.
Surface Mount Packages.
Advanced Packaging.
Suggested Reading.Exercises.Package-to-Board InterconnectionTin-Lead System.
Tin-Lead-Silver Alloy System.
Lead-Free Interconnection Alloys.
Super Cooling.
Solder-Substrate Interface Structure.
Adhesive Interconnections.
Interconnection Process/the Assembly.
Insertion Mount and Surface Mount Technologies in Perspective.
Repair.
Rework.
Suggested Reading.Exercises.System PackagingMotherboard.
Daughter Cards/Expansion Cards.
Connectors.
Cable Assemblies and Cables.
Box Assembly.
Suggested Reading.Exercises.Reliability of Electronic PackagingQuality, Reliability, and Assurance.
Reliability Statistical Distributions.
Reliability Tests and Qualification.
Failure Prediction or Estimation Models.
Suggested Reading.Exercises.Failure Modes and MechanismsDesign-Related Exposures.
Manufacturing Defects and Failures.
Laminate or PWB Failures.
Package Failures.
Interconnection Failures.
Corrosion.
Electromigration.
Intermetallics.
Mechanical Load Failures.
Tin Whiskers.
Suggested Reading.Exercises.Reliability EnhancementsDesign Methodologies.
Physical Enhancements.
Encapsulants, Underfills, and Coatings.
Suggested Reading.Exercises.Emerging Trends in PackagingEmerging Trends.
Package Level Integration.
Nanomaterials and Nanotechnology.
Sensors.
Failures and Assembly Defects.
Suggested Reading.Exercises.Appendixes
Abbreviations.
Glossary of Terms in Electronic Packaging... Select Properties of Materials of Importance in Electronic Packaging.
Standards.
Source Books.Author Biography
Index