Hoboken: Wiley, 2011. — 402 p.
A unique book that describes the practical processes necessary to achieve failure free equipment performance, for quality and reliability engineers, design, manufacturing process and environmental test engineers.
This book studies the essential requirements for successful product life cycle management. It identifies key contributors to failure in product life cycle management and particular emphasis is placed upon the importance of thorough Manufacturing Process Capability reviews for both in-house and outsourced manufacturing strategies. The readers attention is also drawn to the many hazards to which a new product is exposed from the commencement of manufacture through to end of life disposal.
Foreword by Michael Pecht.
Series Editor’s Preface.
About the Author.
Acknowledgements.
The Origins and Evolution of Quality and Reliability.
Product Lifecycle Management.
The Physics of Failure.
Heat Transfer – Theory and Practice.
Shock and Vibration – Theory and Practice.
Achieving Environmental-Test Realism.
Essential Reliability Technology Disciplines in Design.
Essential Reliability Technology Disciplines in Development.
Essential Reliability Technology Disciplines in Manufacturing.
Environmental-Stress Screening.
Some Worked Examples.
Overview.
Thermal Expansion Stresses Generated within a PTH Due to Temperature Cycling.
Shear Tear-Out Stresses in Through-Hole Solder Joints.
Axial Forces on a Through-Hole Component Lead Wire.
SMC QFP – Solder-Joint Shear Stresses.
Frequency and Peak Half-Amplitude Displacement Calculations.
Random Vibration – Converting G2/Hz to GRMS.
Accelerated Ageing – Temperature Cycling and Vibration.
Stress Screening – Production Vibration Fixture Design.
References.
Appendix. Physical Properties of Materials.
Appendix. Unit Conversion Tables.