Murshed S.M.S. (ed.) Electronics Cooling

New York: InTechOpen, 2016. — 180 p. — ISBN13: 978-9535124054.Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling.
It includes following thematic topics:
Cooling approaches and coolants;
Boiling and phase change-based technologies;
Heat pipes-based cooling;
Microchannels cooling systems;
Heat loop cooling technology;
Nanofluids as coolants;
Theoretical development for the junction temperature of package chips.
This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.Introductory Chapter: Electronics Cooling — An Overview.
Boiling of Immiscible Mixtures for Cooling of Electronics.
Heat Pipe and Phase Change Heat Transfer Technologies for Electronics Cooling.
Heat Pipes for Computer Cooling Applications.
MEMS-Based Micro-heat Pipes.
Performance Evaluation of Nanofluids in an Inclined Ribbed MicroChannel for Electronic Cooling Applications.
Reciprocating Mechanism-Driven Heat Loop (RMDHL) Cooling Technology for Power Electronic Systems.
Theoretical Derivation of Junction Temperature of Package Chip.