Weston D.A. Electromagnetic Compatibility: Methods, Analysis, Circuits, and Measurement

3rd edition. — Boca Raton: CRC Press, 2016. — 1184 p. — ISBN: 978-1482299502.Revised, updated, and expanded, Electromagnetic Compatibility: Methods, Analysis, Circuits, and Measurement, Third Edition provides comprehensive practical coverage of the design, problem solving, and testing of electromagnetic compatibility (EMC) in electrical and electronic equipment and systems.
This new edition provides novel information on theory, applications, evaluations, electromagnetic computational programs, and prediction techniques available. With sixty-nine schematics providing examples for circuit level electromagnetic interference (EMI) hardening and cost effective EMI problem solving, this book also includes 1130 illustrations and tables. Including extensive data on components and their correct implementation, the myths, misapplication, misconceptions, and fallacies that are common when discussing EMC/EMI will also be addressed and corrected.Preface.
Author.Electromagnetic Compatibility.
Introduction to Electromagnetic Interference.
Introduction to Electromagnetic Interference Regulations.
Electromagnetic Environment.
Industrial, Scientifi, and Medical Equipment.
Noise from Traffi, Fluorescent Tubes, Microwave Ovens, and Magnetic Fields in the Home and Office.
Hospital Environment.
Intentional Emitters.
Low-Power Intentional Radiators.
High-Power Intentional Radiators.
Conducted Noise on Power Lines.Introduction to E and H, Near and Far Fields, Radiators, Receptors, and Antennas.
Static and Quasi-Static Fields.
Electric Waves on Wires and in Free Space.
Radiated Power.
Units of Measurement.
Receiving Properties of an Antenna.
Simple, Easily Constructed E- and H-Field Antennas.
Nonionizing Electromagnetic Field Exposure Safety Limits.
Computer Programs.Typical Sources and Characteristics of Radiated and Conducted Emissions.
Introduction to Noise Sources.
Fourier Transform Methods and Computer Programs.
Case Study 3.1: Noise Levels Generated by DC-to-DC Converters.
Transmitter-Generated Noise.Crosstalk and Electromagnetic Coupling between Printed Circuit Board Tracks, Wires, and Cables.
Introduction to Crosstalk and Electromagnetic Coupling.
Capacitive Crosstalk and Electric Field Coupling between Wires and Cables.
Inductive Crosstalk and Magnetic Field Coupling between Wires and Cables.
Combined Inductive and Capacitive Crosstalk.Components, Emission Reduction Techniques, and Noise Immunity.
Components.
Power-Line Filters.
Signal Filters.
Emission Reduction Techniques.
Noise Immunity.
Noise Sources and Levels.
Radiated Emission Reduction.
Transient Protection.
Transient Protection Devices.
Lightning Protection.
Electrostatic Protection.
Electromagnetic Pulse Protection.Electromagnetic Shielding.
Reflction, Absorption, and Shielding Effectiveness.
Shielding Effectiveness.
New Shielding Materials: Conductive Paints and Thermoplastics, Plastic Coatings, and Glue.
Seams, Joints, Ventilation, and Other Apertures.
Attenuation of Enclosure with Joints and Apertures to an H Field.
Gasketing Theory, Gasket Transfer Impedance, Gasket Types, and Surface Finish.
Waveguide Gaskets.
Conductive Finishes, DC Resistance, and Corrosion Effects on Gasket Materials.
Practical Shielding and Limitation on Effectiveness.
Compartmentalization.
Shielding Effectiveness of Buildings.
Computer Program for Evaluating Shielding Effectiveness.Cable Shielding, Coupling from E and H Fields, and Cable Emissions.
Introduction to Cable Coupling and Emissions.
Cable Shielding Effectiveness/Transfer Impedance.
Semirigid Cable.
Long-Line Effects.
Transfer Admittance.
Shield Termination Effects on Transferred Voltage.
Coupling from E and H Fields.
Use of the NEC Program to Model the Coupling to Cables in, or Close to, Free Space Conditions.
Cable Shielding Effectiveness in Gigahertz.
Shielding Effectiveness of Cables up to 12 GHz.
Polarization and Angle of Incidence.
Shield Termination to Ground.
Emissions from Cables and Wires.
Reduction in the Emission of E and H Fields from Cables.
Shielded Connectors, Backshells, and Other Shield Termination Techniques.
Ethernet and USB Connectors.
Alternative Cable Shield Termination Techniques.
Practical Level of Cable Shielding Required to Meet MIL-STD/DO-160C or Commercial Radiated Emission Requirements.
Connection of Shield to the Outside or Inside of the Enclosure?Grounding and Bonding.
Introduction to Grounding.
Safety Grounds, Earth Grounds, and Large-System Grounding.
Signal Ground and Power Ground.
Guidelines for Signal Grounding.
Power and Grounding Diagrams.
Grounding for Lightning Protection.
Bonding.EMI Measurements, Control Requirements, and Test Methods.Test Equipment.
Diagnostic Measurements.
Commercial EMI Requirements and Measurement.
Shielded Rooms, Anechoic Chambers, Transmission Lines, and Cell Antennas.
Military EMI Requirements and Measurement Techniques.
RTCA/DO-160 Requirements.System EMC and Antenna Coupling.
System-Level Electromagnetic Compatibility.
Antenna-Coupled EMI.
Ambient Site Predictions and Surveys.
Case Study 10.3: Coupling into HV AC Line from HF Phased-Array Radar.Printed Circuit Boards.Principles of Radiation from Printed Circuit Boards.
Low-Level Radiation PCB Layout: Test Data, Layout Comparison, and Recommendations.
Summary of Differential Confiuration Results and Conclusions at Low Frequency.
Practical PCB Layout.
Comparison of Logic Types.
Circuit-Level Reduction Techniques.
PCB Grounding.
Shielding a Printed Circuit Board.
PCB Radiation, Crosstalk Prediction, and CAD Programs.
PCB Decoupling Capacitors, Imbedded Capacitance, and the EBG.
PCB Layout Case Studies.
Increased Printed Circuit Board Immunity.EMI and EMC Control, Case Studies, EMC Prediction Techniques, and Computational Electromagnetic Modeling.
EMC Control.
EMI Investigations.
EMC Predictions: General Approach.
EMC, Computational Electromagnetic Modeling, and Field Solver Computer Programs.
Electrostatic, Magnetostatic, Low Frequency and Quasi-Static Field Analysis.
Errors Seen in the Use of Electromagnetic Analysis Programs.Appendixes:
Characteristic Impedance of Conductors, Wires, and Cables.
Units and Conversion Factors.
Electric Field Strength to Magnetic Field to Power Density Conversions.
Commonly Used Related Formulas.
Data on Bare Solid Copper Wire (Dimensions, Weight, and Resistance).
Permittivity of Materials.