Murshed S.M.S. (Ed.) Electronics Cooling

ITexLi, 2016. — 180 p. — ISBN: 9535124064.This book covers key conventional and emerging cooling techniques and coolants for electronics cooling. The book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.Introductory Chapter: Electronics Cooling — An Overview.
Boiling of Immiscible Mixtures for Cooling of Electronics.
Heat Pipe and Phase Change Heat Transfer Technologies for Electronics Cooling.
Heat Pipes for Computer Cooling Applications.
MEMS-Based Micro-heat Pipes.
Performance Evaluation of Nanofluids in an Inclined Ribbed Microchannel for Electronic Cooling Applications.
Reciprocating Mechanism–Driven Heat Loop (RMDHL) Cooling Technology for Power Electronic Systems.
Theoretical Derivation of Junction Temperature of Package Chip.Introductory Chapter: Electronics Cooling — An Overview
by S M Sohel Murshed.
Boiling of Immiscible Mixtures for Cooling of Electronics
by Haruhiko Ohta, Yasuhisa Shinmoto, Daisuke Yamamoto and Keisuke Iwata.
Heat Pipe and Phase Change Heat Transfer Technologies for Electronics Cooling
by Chan Byon.
Heat Pipes for Computer Cooling Applications
by Mohamed H.A. Elnaggar and Ezzaldeen Edwan.
MEMS-Based Micro-heat Pipes
by Qu Jian and Wang Qian.
Chapter 6 Performance Evaluation of Nanofluids in an Inclined
Ribbed Microchannel for Electronic Cooling Applications
by Mohammad Reza Safaei, Marjan Gooarzi, Omid Ali Akbari, Mostafa Safdari Shadloo and Mahidzal Dahari.
Reciprocating Mechanism–Driven Heat Loop (RMDHL) Cooling Technology for Power Electronic Systems
by Olubunmi Popoola, Soheil Soleimanikutanaei and Yiding Cao.
Theoretical Derivation of Junction Temperature of Package Chip
by Professor Wei-Keng Lin.