Johnson R.W., Teng R.K.F., Balde J. (eds.) Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies

NY: IEEE Press, 1991. — ix, 603 p. — (IEEE Press Selected Reprint Series). — ISBN13: 978-0879422677, ISBN10: 087942267X.Analysis of Packaging Issues.
Cofired Ceramic Technology.
Thin Film Multilayer Modules on Silicon.
Thin Film Multilayer Modules on Ceramic or Metal.
Thin Film Dielectric Materials.
Cofired Glass/Ceramic Technology.
Thermal Analysis of Multichip Modules.
Electrical Analysis and Testing of Multichip Modules.