Alexe Marin, Gösele Ulrich (eds.) Wafer Bonding: Applications and Technology

Berlin, Heidelberg: Springer, 2004. — 499 p., 372 fig., 25 tables. — (Springer Series in Materials Science, vol. 75). — ISBN10: 3540210490, ISBN13: 9783540210498.During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.Direct Bonding, Fusion Bonding, Anodic Bonding Wafer Bonding: A Historical Patent Picture of the Worldwide Moving Front of the State-of-the-Art of Contact Bonding
Basics of Silicon-on-lnsulator SOI Technology
Silicon-on-Insulator by the Smart Cut Process
ELTRAN Technology Based on Wafer Bonding and Porous Silicon
Wafer Bonding for High-Performance Logic Applications
Application of Bonded Wafers to the Fabrication of Electronic Devices
Compound Semiconductor Heterostructures by Smart Cut: SiC On Insulator, QUASIC Substrates InP and GaAs Heterostructures on Silicon
Three Dimensional Photonic Bandgap Crystals by Wafer Bonding Approach
Wafer Direct Bonding for High-Brightness Light-Emitting Diodes and Vertical-Cavity Surface-Emitting Lasers
High-Density Hybrid Integration of III-V Compound Optoelectronics with Silicon Integrated Circuits
Layer Transfer by Bonding and Laser Lift-Off
Single-Crystal Lithium Niobate Films by Crystal Ion Slicing
Wafer Bonding of Ferroelectric Materials
Debonding of Wafe-rBonded Interfaces for Handling and Transfer Applications