Bar-Cohen A. (Ed.) Encyclopedia Of Thermal Packaging. Set 1: Thermal Packaging Techniques

Singapore: World Scientific, 2013. — 1438 p. — ISBN10: 9814313785The books included in "Set 1: Thermal Packaging Techniques" focus on the technology "building blocks" used to assemble a complete thermal management system and provide detailed descriptions of the underlying phenomena, modeling equations, and correlations, as well as guidance for achieving the optimal designs of individual "building blocks" and their insertion in the overall thermal solution.Specific volumes deal with microchannel coolers, cold plates, immersion cooling modules, and thermoelectric microcoolers.
Volume 1: Microchannel Heat Sinks for Electronics Cooling
Volume 2: Air- and Liquid-Cooled Cold Plates
Volume 3: Dielectric Liquid Cooling of Immersed Components
Volume 4: Thermoelectric Microcoolers
Volume 5: Energy Effi cient Solid State Lighting
Volume 6: Experimental Thermofluid Characterization of Electronic ComponentsPackaging, the physical design and implementation of electronic systems is responsible for much of the progress in miniaturization, reliability and functional density achieved by the full range of electronic, microelectronic and nanoelectronic products during the past several decades. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal management on the critical path of nearly every organization dealing with traditional electronic product development, as well as emerging, product categories. Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of critical importance in the refinement of traditional products and in the development of products for new applications. "The Encyclopedia of Thermal Packaging," compiled into four 5-volume sets ("Thermal Packaging Techniques," "Thermal Packaging Configurations," "Thermal Packaging Tools," and "Thermal Packaging Applications"), will provide comprehensive, one-stop treatment of the techniques, configurations, tools and applications of electronic thermal packaging. Each volume in a set comprises 250-350 pages and is written by world experts in thermal management of electronics.