Zhang G.Q., van Driel V.D., Fan X.J. Mechanics of Microelectronics

Springer, 2006. — XIV, 566 p. — ISBN: 978-1-4020-4935-4.From a mechanical engineering point of view, Microelectronics and Microsystems are multi-scale in both geometric and time domains, multi-process, multi-functionality, multi-disciplinary, multi-material/interface, multi-damage and multi-failure mode. Their responses in manufacturing, assembling, qualification tests and application conditions are strongly nonlinear and stochastic. Mechanics of Microelectronics is extremely important and challenging, in terms of both industrial applications and academic research.
Written by the leading experts with both profound knowledge and rich practical experience in advanced mechanics and microelectronics industry, this book aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains essential and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.Preface.

Microelectronics Technology.Baseline CMOS.
Non-CMOS Options.
Packaging.
Systems.
Conclusions.Nomenclature.Reliability Practice.Reliability Assessment.
Reliability Statistics.
Acceleration Factor Models.
Failure Mechanisms.
Conclusions.Exercises.Thermal Management.Heat Transfer Basics.
Thermal Design of Assemblies.
Thermal Design for a SQFP.
Heatsink Design Choices.
Conclusions/Final Remarks.Exercises.Introduction to Advanced Mechanics.Stress and Strain.
Failure Criteria.
Fracture Mechanics.
Finite Element Method.Exercises.Thermo-Mechanics of Integrated Circuits and Packages.Manufacturing Processes and Testing Methods.
Thermo-Mechanics ofIC Backend Processes.
Thermo-Mechanics of Packaging Processes.
Thermo-Mechanics of Coupled IC Backend and Packaging Processes.
Case Studies.Exercises.Characterization and Modelling of Moisture Behaviour.Moisture Diffusion Modelling.
Characterization of Moisture Diffusivity and Saturation Concentration.
Vapour Pressure Modelling.
Hygroscopic Swelling Characterization & Modelling.
Single Void Instability Behaviour Subjected to Vapour Pressure and Thermal Stress.
Interface Strength Characterization and Modelling.
Case Studies.Exercises.Characterization and Modelling of Solder Joint Reliability.Analytical-Empirical Prognosis of the Reliability.
Thermo-Mechanical Characteristics of Soft Solders.
Data Evaluation and Life-time Estimation.
Case Studies.Exercises.Virtual Thermo-Mechanical Prototyping.Strategy, Methodology and Procedures of Virtual Prototyping.
Fundaments of Simulation-based Optimisation.
Case Studies.
Conclusions.Exercises.Challenges and Future Perspectives.Mechanical Related Characteristics of Microelectronics.
Reliable Inputs.
Tests and Experiments.
Material and Interface Behaviour.
Multi-scale Mechanics.
Multi-Physics Modelling.
Advanced Simulation Tools.
Conclusions.