Kuang K., Kim F., Cahill S.S. (eds.) RF and Microwave Microelectronics Packaging

Springer Science+Business Media, 2010. — 285 p. — ISBN10: 1441909834.RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.Fundamentals of packaging at microwave and millimeter-wave frequencies.
Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.
Polymeric Microelectromechanical Millimeter Wave Systems.
Millimeter-Wave Chip-on-Board Integration and Packaging.
Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.
RF/Microwave Substrate Packaging Roadmap for Portable Devices.
Ceramic systems in package for RF and microwave.
Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.
LTCC Substrates For RF/MW Application.
High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.
High Performance Microelectronics Packaging Heat Sink Materials.
Technology Research on AlN 3D MCM.